The 3A5000 uses the Chinese in-house 64-bit GS464V microarchitecture, featuring support for DDR4-3200 dual-channel memory, a primary encryption module, two 256-bit vector units per core, and four arithmetic logic units.

Loongson Technology's new processor also operates with four HyperTransport 3.0 SMP controllers that "allow multiple 3A5000s to operate in unison inside a single system.

Loongson also plans to release a 32-core variant based on the same architecture known as the 3D5000 and it will feature two 3C5000 dies on the same package. So essentially, a multi-chiplet solution.

Meanwhile, Loongson also unveiled that they plan to launch their next-generation 6000 series chips which will offer a brand new microarchitecture and offer IPC on par with AMD's Zen 3 CPUs.

The Loongson 3A5000 is competitive in the single-core performance workloads vs a range of ARM chips (7nm) and even an Intel Core i7-10700. Loongson also posted the simulated performance of their next-gen 6000 series

CPUs which offer up to 30 per cent higher fixed & 60 per cent higher floating-point performance versus the existing 5000 series chips.

The performance comparison shows a 3A5000 4 core CPU with 2.5 GHz clock speed compared to a Core i7-10700 'Comet Lake' CPU with 8 cores and 2.9 GHz clock speed.

Because the chips are made locally, the prices that these chips carry will be very economical for use in China's educational and tech centers.

This could mean that we see Chinese chips targeting AMD Ryzen and EPYC CPUs based on the Zen 3 core architecture by next year.

Having a chip that matches Zen 3 in IPC will bring them close to the performance level of modern chips.