News - subcat

TSMC unveils 9.5-reticle CoWoS packaging
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Chip packaging just got absurdly massive

TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit.

Wall Street's AI debt bubble inflates on Nvidia's silicon
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Industry is built on loaning cash to buy Nvidia chips

The cocaine nose jobs of Wall Street have lobbed more than $11 billion at “neocloud” outfits like CoreWeave, Crusoe and Lambda Labs, betting that a warehouse full of Nvidia chips is as good as gold.

Apple flees China, eyes India for US iPhone assembly
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Tariffs push Job’s Mob to double down on Indian production

The Fruity Cargo Cult Apple is scrambling to shift all US-bound iPhone assembly to India by 2026, as US tariff tantrums make China too hot to handle.

TSMC flashes 1.4nm tech
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Big speed gains but no SPR for now

TSMC has rolled out its new A14 node, marking its first foray into the 1.4 nm-class manufacturing tech, and it’s already boasting serious gains in performance, power efficiency, and logic density.

SK Hynix doubles profit on AI chip boom
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Brushes off tariff fears

SK Hynix, Nvidia’s go-to for high-bandwidth memory, has posted a 158 per cent leap in quarterly operating profit, hitting 7.4 trillion won (€5.1 billion), while shrugging off the usual US trade panic.